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dc.date.accessioned2020-06-12T18:02:58Z
dc.date.available2020-06-12T18:02:58Z
dc.date.created2019-04-05T15:45:36Z
dc.date.issued2019
dc.identifier.citationVenkatesan, Ragavendran Mayandi, Jeyanthinath Pearce, Joshua M. Venkatachalapathy, Vishnukanthan . Influence of metal assisted chemical etching time period on mesoporous structure in as-cut upgraded metallurgical grade silicon for solar cell application. Journal of materials science. Materials in electronics. 2019, 30(9), 8676-8685
dc.identifier.urihttp://hdl.handle.net/10852/76923
dc.description.abstractIn this work, upgraded metallurgical grade silicon (UMG-Si) wafer was used to fabricate mesoporous nanostructures, as an effective antireflection layer for solar photovoltaic cells. The length of the vertical Si nanostructure (SiNS) arrays was altered by varying the etching time period during metal assisted chemical etching process, using a silver catalyst. The optical, structural, morphological changes and the antireflection properties of Si nanostructures formed on UMG-Siwafer were analysed. SEM and photoluminescence studies indicate that Si nanocrystals are formed on the surface and along the vertical nanowires. The pore size depends on the Ag nanoparticle size distribution. All the samples demonstrated a luminescence band centred around 2.2 eV. From the optical results, samples etched for 45 min show strong absorption in the visible spectrum. The minimum and maximum surface reflectance in the visible region was observed for 15 min and 60 min etched SiNS. Based on the observed results, 15 min etched Si with a uniform porous structure has minimum reflectance across the entire silicon UV–Vis absorption spectrum, making it worth further investigation as a candidate for use as an antireflection layer in silicon based solar cells.
dc.languageEN
dc.titleInfluence of metal assisted chemical etching time period on mesoporous structure in as-cut upgraded metallurgical grade silicon for solar cell application
dc.typeJournal article
dc.creator.authorVenkatesan, Ragavendran
dc.creator.authorMayandi, Jeyanthinath
dc.creator.authorPearce, Joshua M.
dc.creator.authorVenkatachalapathy, Vishnukanthan
cristin.unitcode185,15,17,0
cristin.unitnameSenter for materialvitenskap og nanoteknologi
cristin.ispublishedtrue
cristin.fulltextpostprint
cristin.qualitycode1
dc.identifier.cristin1690513
dc.identifier.bibliographiccitationinfo:ofi/fmt:kev:mtx:ctx&ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Journal of materials science. Materials in electronics&rft.volume=30&rft.spage=8676&rft.date=2019
dc.identifier.jtitleJournal of materials science. Materials in electronics
dc.identifier.volume30
dc.identifier.issue9
dc.identifier.startpage8676
dc.identifier.endpage8685
dc.identifier.doihttps://doi.org/10.1007/s10854-019-01191-6
dc.identifier.urnURN:NBN:no-80036
dc.type.documentTidsskriftartikkel
dc.type.peerreviewedPeer reviewed
dc.source.issn0957-4522
dc.identifier.fulltextFulltext https://www.duo.uio.no/bitstream/handle/10852/76923/2/Manuscript_JMSE.pdf
dc.type.versionAcceptedVersion
dc.relation.projectNFR/255082


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