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dc.date.accessioned2020-05-14T19:39:01Z
dc.date.available2020-05-14T19:39:01Z
dc.date.created2019-09-29T19:33:50Z
dc.date.issued2019
dc.identifier.citationMahmood, Sohail Musa Røed, Ketil . Investigation of Single Event Latch-up effects in the ALICE SAMPA ASIC. PoS - Proceedings of Science. 2019
dc.identifier.urihttp://hdl.handle.net/10852/75621
dc.description.abstractDuring RUN 3 and RUN 4 at the Large Hadron Collider (LHC), the SAMPA chip will be used in the upgraded front end electronics of the ALICE (A Large Ion Collider Experiment) Time Projection Chamber (TPC) and Muon Chambers (MCH). Previously, it was reported that the SAMPA V2 prototypes were susceptible to the high energy proton induced Single Event Latch-up (SEL) events. Further irradiation campaigns were required to find the source of SEL events in SAMPA V2 prototypes, and to verify that the SEL sensitivity of final versions (V3 and V4) of the SAMPA chip was reduced or even completely removed. The irradiation campaigns were performed using the Heavy-Ion Facility (HIF) at UCL (Universitè Catholique de Louvain) in Belgium and the Single-Photon laser facility at IES (Institute of Electronics and Systems), Montpellier-France.
dc.languageEN
dc.publisherScuola Internazionale Superiore di Studi Avanzati
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/
dc.titleInvestigation of Single Event Latch-up effects in the ALICE SAMPA ASIC
dc.typeJournal article
dc.creator.authorMahmood, Sohail Musa
dc.creator.authorRøed, Ketil
cristin.unitcode185,15,4,0
cristin.unitnameFysisk institutt
cristin.ispublishedtrue
cristin.fulltextoriginal
cristin.qualitycode1
dc.identifier.cristin1730888
dc.identifier.bibliographiccitationinfo:ofi/fmt:kev:mtx:ctx&ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=PoS - Proceedings of Science&rft.volume=&rft.spage=&rft.date=2019
dc.identifier.jtitlePoS - Proceedings of Science
dc.identifier.doihttps://doi.org/10.22323/1.343.0023
dc.identifier.urnURN:NBN:no-78700
dc.type.documentTidsskriftartikkel
dc.type.peerreviewedPeer reviewed
dc.source.issn1824-8039
dc.identifier.fulltextFulltext https://www.duo.uio.no/bitstream/handle/10852/75621/2/TWEPP2018_023.pdf
dc.type.versionPublishedVersion


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Attribution-NonCommercial-NoDerivatives 4.0 International
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